Teledyne
Teledyne 6RU Rack Mountable GaAs Solid State Power Amplifier
Request a quote at Contact@orbitalconnect.com or +1.888.315.9545
Description
Teledyne Paradise Datacom’s Indoor, High Power Rack Mount (R) series SSPAs represent the industry’s highest power density and most reliable high power amplifier systems. These high power amplifiers are accompanied with a separate 1RU power supply chassis. The power supply is configured as a n+1 redundant, hot swappable power supply comprised of up to four modules. The power supply is populated with one module more than needed to power the HPA. In the event of a single power supply module failure, the amplifier system will not fail. The power supply module can be changed without ever taking the HPA out of service. The microwave amplifier architecture is also designed for maximum soft fail redundancy. The High Power Rack Mount SSPA employs a modular design, which allows quick and easy replacement in the event of a catastrophic failure of one of the SSPA components. These modular assemblies include: front and rear fan trays; and a rear panel controller card.
Features
- Extremely High Power Density:
to 1.1 kW C-Band;
to 1000W X-Band;
to 500W Ku-Band.
- Hot Swap, n+1 Redundant Power Supply
- Power Factor Corrected Power Supply
- Modular (soft-fail) Architecture
- Front Panel Touchscreen
- Removable fan assemblies
- Ethernet Port
- RF Output Sample Port
- Built-in 1:1 Redundancy Control
- Built-in Maintenance Switch Controller
Options
- Extended Frequency Band
- L-Band Input operation
- Reflected Power Monitor
- Phase Combined Systems
- Remote Control Panel
- RF Input Sample Port
- Rear Panel Exhaust
SPECIFICATIONS
- SSPA Chassis housing: 19.0 X 10.47 X 30.25 in
483 X 266 X 768 mm 180 lbs. / 82 kg
- 1RU Power Supply:
19.0 X 1.75 X 16.30 in 483 X 45 X 414 mm 33 lbs. / 15 kg
- Gray powder coat finish
- Operating temperature: 0 to +50 °C
Description
Teledyne Paradise Datacom’s Indoor, High Power Rack Mount (R) series SSPAs represent the industry’s highest power density and most reliable high power amplifier systems. These high power amplifiers are accompanied with a separate 1RU power supply chassis. The power supply is configured as a n+1 redundant, hot swappable power supply comprised of up to four modules. The power supply is populated with one module more than needed to power the HPA. In the event of a single power supply module failure, the amplifier system will not fail. The power supply module can be changed without ever taking the HPA out of service. The microwave amplifier architecture is also designed for maximum soft fail redundancy. The High Power Rack Mount SSPA employs a modular design, which allows quick and easy replacement in the event of a catastrophic failure of one of the SSPA components. These modular assemblies include: front and rear fan trays; and a rear panel controller card.
Features
- Extremely High Power Density:
to 1.1 kW C-Band;
to 1000W X-Band;
to 500W Ku-Band.
- Hot Swap, n+1 Redundant Power Supply
- Power Factor Corrected Power Supply
- Modular (soft-fail) Architecture
- Front Panel Touchscreen
- Removable fan assemblies
- Ethernet Port
- RF Output Sample Port
- Built-in 1:1 Redundancy Control
- Built-in Maintenance Switch Controller
Options
- Extended Frequency Band
- L-Band Input operation
- Reflected Power Monitor
- Phase Combined Systems
- Remote Control Panel
- RF Input Sample Port
- Rear Panel Exhaust
SPECIFICATIONS
- SSPA Chassis housing: 19.0 X 10.47 X 30.25 in
483 X 266 X 768 mm 180 lbs. / 82 kg
- 1RU Power Supply:
19.0 X 1.75 X 16.30 in 483 X 45 X 414 mm 33 lbs. / 15 kg
- Gray powder coat finish
- Operating temperature: 0 to +50 °C